| 两侧同时换到之前的修订记录前一修订版后一修订版 | 前一修订版 |
| knowledge [2023/02/01 14:07] – 弘毅 | knowledge [2024/01/24 02:54] (当前版本) – 弘毅 |
|---|
| <WRAP center round box > | <WRAP center round box > |
| |
| ===== 3D Print ===== | ===== 3D打印 ===== |
| |
| [[knowledge:3d_print:2021121602|3D打印拉丝处理办法]] | [[knowledge:3d_print:2021121602|3D打印拉丝处理办法]] |
| \\ [[knowledge:3d_print:2022100102|APE G1 G-code]] | \\ [[knowledge:3d_print:2022100102|APE G1 G-code]] |
| \\ [[knowledge:3d_print:2022100601|APE G1 TMC2130步进电机驱动配置说明]] | \\ [[knowledge:3d_print:2022100601|APE G1 TMC2130步进电机驱动配置说明]] |
| \\ [[knowledge:3d_print:2022102301|External SPI flash XFLASH is not responding错误分析]] | \\ [[knowledge:3d_print:2022102301|External SPI flash XFLASH is not responding 错误分析]] |
| | \\ [[knowledge:3d_print:2023022801|Calibration failed! Check the axes and run again. 错误分析]] |
| \\ [[knowledge:3d_print:2022110601|3D打印机SD卡打印时自动回到左下角0点停止打印问题处理]] | \\ [[knowledge:3d_print:2022110601|3D打印机SD卡打印时自动回到左下角0点停止打印问题处理]] |
| \\ [[knowledge:3d_print:2022120201|M112 called Emergency Stop错误分析]] | \\ [[knowledge:3d_print:2022120201|M112 called Emergency Stop错误分析]] |
| \\ [[knowledge:3d_print:2023010201|APE G1 固件编译方法]] | \\ [[knowledge:3d_print:2023010201|APE G1 固件编译方法]] |
| \\ [[knowledge:3d_print:2023010601|3D打印材料特性与烘干温度]] | |
| \\ [[knowledge:3d_print:2023011101|Linear Advance]] | \\ [[knowledge:3d_print:2023011101|Linear Advance]] |
| \\ [[knowledge:3d_print:2023020101|Slic3r流量算法]] | \\ [[knowledge:3d_print:2023020101|Slic3r流量算法]] |
| \\ [[knowledge:3d_print:2023020102|FDM 3D打印 Z轴成型研究]] | \\ [[knowledge:3d_print:2023020102|FDM 3D打印 Z轴成型研究]] |
| | \\ [[knowledge:3d_print:2023021001|Marlin固件代码结构]] |
| | \\ [[knowledge:3d_print:2023021101|Marlin的硬件访问层]] |
| | \\ [[knowledge:3d_print:2023052301|Marlin编码标准]] |
| | ==== 材料 ==== |
| | [[knowledge:3d_print:2023010601|3D打印材料特性与烘干温度]] |
| | \\ [[knowledge:3d_print:2023021901|结晶塑料与非结晶塑料]] |
| |
| ===== FreeCAD ===== | ===== FreeCAD ===== |
| \\ [[knowledge:electronic:CapSense|电容触摸]] | \\ [[knowledge:electronic:CapSense|电容触摸]] |
| \\ [[knowledge:electronic:2023010301|PLC的继电器与晶体管输出]] | \\ [[knowledge:electronic:2023010301|PLC的继电器与晶体管输出]] |
| | \\ [[knowledge:electronic:2023070901|STM32应用笔记]] |
| | \\ [[knowledge:electronic:2024012401|三相电导线颜色（世界各国）]] |
| | |
| | ==== 机械 ==== |
| | \\ [[knowledge:mechanical:2022092601|什么是强力磁铁 Neodymium magnet]] |
| | \\ [[knowledge:mechanical:2022121601|常用螺纹攻丝前用钻头直径速查表]] |
| | \\ [[knowledge:mechanical:2023010801|同步带的种类与区别]] |
| | \\ [[knowledge:mechanical:2023021501|运动约束原理]] |
| | |
| ==== 通信协议 ==== | ==== 通信协议 ==== |
| [[knowledge:electronic:modbus|Modbus]] | [[knowledge:electronic:modbus|Modbus]] |
| \\ [[knowledge:electronic:open hardware|开源硬件]] | \\ [[knowledge:electronic:open hardware|开源硬件]] |
| \\ [[knowledge:electronic:2022010701|风量CFM换算(风量CFM和立方米换算)]] | \\ [[knowledge:electronic:2022010701|风量CFM换算(风量CFM和立方米换算)]] |
| \\ [[knowledge:mechanical:2022092601|什么是强力磁铁 Neodymium magnet]] | |
| \\ [[knowledge:mechanical:2022121601|常用螺纹攻丝前用钻头直径速查表]] | |
| \\ [[knowledge:mechanical:2023010801|同步带的种类与区别]] | |
| </WRAP> | </WRAP> |
| <WRAP center round box > | <WRAP center round box > |
| \\ [[knowledge:electronic:20180421|印刷电路板(PCB)的历史]] | \\ [[knowledge:electronic:20180421|印刷电路板(PCB)的历史]] |
| \\ [[knowledge:electronic:20180928|高压栅极驱动 IC 自举电路的设计与应用指南]] | \\ [[knowledge:electronic:20180928|高压栅极驱动 IC 自举电路的设计与应用指南]] |
| \\ [[knowledge:electronic:2019032101|Arduino sound level meter and spectrum analyzer]] | \\ [[knowledge:electronic:2019032101|Arduino声级计和频谱分析仪]] |
| \\ [[knowledge:electronic:2019032102|SAVED BY THE BEL — UNDERSTANDING DECIBELS]] | \\ [[knowledge:electronic:2019032102|SAVED BY THE BEL — UNDERSTANDING DECIBELS]] |
| \\ [[knowledge:electronic:2019032103|40 cent DIY pressure sensor based on a capacitive principle]] | \\ [[knowledge:electronic:2019032103|40 cent DIY pressure sensor based on a capacitive principle]] |
